CVE intelligence and bounded remediation

CVE-2022-25334 — Ti Omap L138 Firmware security vulnerability

High CVSS 8.8

The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) lacks a bounds check on the signature size field in the SK_LOAD module loading routine, present in mask ROM. A module with a sufficiently large signature field causes a stack overflow, affecting secure kernel data pages. This can be leveraged to obtain arbitrary code execution in secure supervisor context by overwriting a SHA256 function pointer in the secure kernel data area when loading a forged, unsigned SK_LOAD module encrypted with the CEK (obtainable through CVE-2022-25332). This constitutes a full break of the TEE security architecture.

Severity
High
CVSS
8.8 (3.1)
Published
2023-10-19
CISA KEV
Not currently listed
Ecosystem
operating-system
Weaknesses
CWE-121, CWE-787

Affected products

  • ti / omap_l138_firmware

Matched remediation archetype

Buffer bounds, memory safety, and memory corruption

This catalog composition supplies bounded fallback guidance. Explicitly reviewed curated workflows load with the complete record below.

Check exposure

  • Identify affected native-code versions, build flags, architectures, parsers, codecs, drivers, and input paths in all shipped artifacts.
  • Determine whether untrusted data reaches the affected routine and the process privilege, sandbox, and network exposure.
  • Confirm statically linked, vendored, firmware, and platform-provided copies, not only package-manager records.

Remediate safely

  • Apply the maintained upstream correction or replace the affected component, then rebuild every dependent artifact from clean inputs.
  • Adopt bounds-checked interfaces, validated sizes and integer conversions, clear ownership, and memory-safe components where practical.
  • Enable supported compiler and runtime hardening and add sanitized tests and fuzz regression seeds derived from non-weaponized fixtures.

Authoritative sources

Complete CVE record and remediation plan

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