CVE intelligence and bounded remediation
CVE-2022-22071 — Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
- Severity
- High
- CVSS
- 8.4 (3.1)
- Published
- 2022-06-14
- CISA KEV
- Known exploited
- Ecosystem
- operating-system
- Weaknesses
- CWE-416
Affected products
- qualcomm / apq8053_firmware
- qualcomm / ar8031_firmware
- qualcomm / ar8035_firmware
- qualcomm / csra6620_firmware
- qualcomm / csra6640_firmware
- qualcomm / mdm9150_firmware
Showing 6 representative product identities from 90 source matches. Confirm exact affected versions with the linked vendor and NVD evidence.
Matched remediation archetype
Use-after-free, double free, and expired resource use
This catalog composition supplies bounded fallback guidance. Explicitly reviewed curated workflows load with the complete record below.
Check exposure
- Trace ownership, references, callbacks, asynchronous tasks, and teardown paths around the affected object or resource.
- Identify reachable inputs and timing or state transitions that can release the object while references remain.
- Confirm affected builds, allocators, feature flags, architectures, and process privileges.
Remediate safely
- Apply the maintained ownership or lifetime fix and rebuild all artifacts containing the affected native code.
- Use explicit ownership, safe reference management, cancellation and join semantics, and idempotent teardown.
- Add deterministic lifetime tests plus isolated sanitizer and concurrency coverage for shutdown and error paths.
Authoritative sources
Complete CVE record and remediation plan
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