CVE intelligence and bounded remediation

CVE-2019-19196 — Telink-Semi Tlsr8258 Ble Sdk security vulnerability

Medium CVSS 6.5

The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.

Severity
Medium
CVSS
6.5 (3.1)
Published
2020-02-12
CISA KEV
Not currently listed
Ecosystem
software/application
Weaknesses
CWE-120

Affected products

  • telink-semi / tlsr8258_ble_sdk
  • telink-semi / tlsr8269_ble_sdk
  • telink-semi / tlsr8253_ble_sdk
  • telink-semi / tlsr8251_ble_sdk
  • telink-semi / tlsr8232_ble_sdk

Matched remediation archetype

Buffer bounds, memory safety, and memory corruption

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Check exposure

  • Identify affected native-code versions, build flags, architectures, parsers, codecs, drivers, and input paths in all shipped artifacts.
  • Determine whether untrusted data reaches the affected routine and the process privilege, sandbox, and network exposure.
  • Confirm statically linked, vendored, firmware, and platform-provided copies, not only package-manager records.

Remediate safely

  • Apply the maintained upstream correction or replace the affected component, then rebuild every dependent artifact from clean inputs.
  • Adopt bounds-checked interfaces, validated sizes and integer conversions, clear ownership, and memory-safe components where practical.
  • Enable supported compiler and runtime hardening and add sanitized tests and fuzz regression seeds derived from non-weaponized fixtures.

Authoritative sources

Complete CVE record and remediation plan

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