CVE intelligence and bounded remediation

CVE-2019-17517 — Dialog-Semiconductor Software Development Kit security vulnerability

Medium CVSS 6.1

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet.

Severity
Medium
CVSS
6.1 (2.0)
Published
2020-02-10
CISA KEV
Not currently listed
Ecosystem
software/application
Weaknesses
CWE-120

Affected products

  • dialog-semiconductor / software_development_kit

Matched remediation archetype

Buffer bounds, memory safety, and memory corruption

This catalog composition supplies bounded fallback guidance. Explicitly reviewed curated workflows load with the complete record below.

Check exposure

  • Identify affected native-code versions, build flags, architectures, parsers, codecs, drivers, and input paths in all shipped artifacts.
  • Determine whether untrusted data reaches the affected routine and the process privilege, sandbox, and network exposure.
  • Confirm statically linked, vendored, firmware, and platform-provided copies, not only package-manager records.

Remediate safely

  • Apply the maintained upstream correction or replace the affected component, then rebuild every dependent artifact from clean inputs.
  • Adopt bounds-checked interfaces, validated sizes and integer conversions, clear ownership, and memory-safe components where practical.
  • Enable supported compiler and runtime hardening and add sanitized tests and fuzz regression seeds derived from non-weaponized fixtures.

Authoritative sources

Complete CVE record and remediation plan

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